机械抛光
实用场景例句
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The principle, tools and characteristics of the electrochemical - mechanical polishing were introduced.
介绍了电化学 — 机械抛光的原理 、 工具及特点.
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The three - in - one combination technology -- electrochemical polishing, mechanical polishing and electrochemical etching punching are introduced.
介绍了一种先进的电化学抛光 、 常规的机械抛光和电化学蚀刻打标三合一技术.
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The Chemical mechanical polishing technique in the field of semiconductor industry was introduced.
介绍了半导体工业中蓬勃发展的化学机械抛光(CMP)技术.
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Recent investigation shows that CeC & gt ; 2 nanoparticles can be used as CMP slurry to polish IC chip.
最新研究表明,纳米 CeO _2可用于集成电路芯片加工的化学机械抛光(CMP)浆料.
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Specification: Metal ingot, mechanically polished detailed specification can be customized in size according to your request.
形状: 金属锭, 机械抛光,每块大小可按顾客的要求.
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The major problem in Cu CMP is dishing, serious dishing will cause the yield loss.
铜化学机械抛光是近些年发展最快的一种工艺,铜碟形是铜化学机械抛光工艺中的主要问题之一.
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Copper nanocrystallites were deposited on mechanically polished single crystal silicon ( sc - Si ) wafers by electroless deposition method.
采用无电镀沉积技术在经过机械抛光的 单晶硅衬底 上沉积了铜纳米晶.
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电子学
mechanical polishing
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