And techniques to make free solder bumping with electroplating are illustrated.

重点阐述了采用电镀制作无铅焊料凸点的方法.

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The sensor chip is flip - chip packaged on a thin ceramic substrate using copper pillar bump technology.

该传感器使用铜柱凸点技术,倒装于薄层陶瓷上.

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Soft silica, comfortable feeling, vogue egg shape with bumps, unique bumps rate design, freely operate!

软胶材质, 手感超好; 时尚的蛋形配搭珠宝粒外观, 独有的凸点比例搭配设计, 取放更自如!

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In general , long pipe of water supply system of station rise and fall with topography variation.

火电厂补给水系统具有管道布置受地形影响起伏波折和管道长的特点,在断电停泵时管道上凸点容易产生负压.

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